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| Product Name: |
High Difficulty 8 Layer Mobile PCB
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| Specifications |
High Difficulty 8 Layer Mobile PCB |
| Price Term: |
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8 layers HDI
Material: FR-4+RCC
Thickness: 1.0mm
Surface processing: Immersion gold
Laser drill hole(Min. ): 0.1mm
Buried and blind via structure: L1-L2, , L2-L7, L8-L7
Min. Line ***ce: 0.1mm
Min. Line width: 0.1mm |
| Company: |
Shanghai Yeqi Electronic Technology Co., Ltd
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| Contact: |
Ms. Cherry Lee |
| Address: |
15f Orient Golden Building, No.729, Pujian Road, Pudong District, Shanghai, China |
| Postcode: |
200127 |
| Tel: |
86-21-61460204-606 |
| Fax: |
86-21-61460304 |
| E-mail: |
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