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Shanghai Yeqi Electronic Technology Co., Ltd

Showing 1 - 8 of 8, total 1 pages        [First] [Previous] [Next] [Last]

1
high difficulty 8 layer mobile pcb
high difficulty 8 layer mobile pcb
Specification: High Difficulty 8 Layer Mobile PCB
Detail: 8 layers HDI Material: FR-4+RCC Thickness: 1.0mm Surface processing: Immersion gold Laser drill hole(Min. ): 0.1mm Buried and blind via structure: L1-L2, , L2-L7, L8-L7 Min. Line ***ce: 0.1mm Min. Line width: 0.1mm

2
high difficulty pcb
high difficulty pcb
Specification: High Difficulty PCB
Detail: Layer: 16 layers Material: FR-4 Thickness: 3.0mm Surface processing: Immersion gold Drill hole(Min. ): 0.3mm Min. Line ***ce: 0.1mm Min. Line width: 0.1mm

3
8 layer mobile pcb
8 layer mobile pcb
Specification: 8 layer mobile PCB
Detail: HDI Material:FR-4+RCC Thickness:1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.13mm Buried and blind via structure:L1-L2,L2-L7,L8-L7 Min. line ***ce: 0.13mm Min. line width: 0.1mm

4
high difficulty 8 layer mobile pcb
high difficulty 8 layer mobile pcb
Specification: High difficulty 8 layer mobile PCB
Detail: 8 layers HDI Material:FR-4+RCC Thickness:1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Buried and blind via structure:L1-L2,L1-L3,L2-L7,L8-L6,L8-L7 Min. line ***ce: 0.1mm Min. line width: 0.1...

5
wireless network-card board
wireless network-card board
Specification: Wireless network-card board
Detail: 6 layers HDI Material:FR-4+RCC Thickness:1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Min. line ***ce: 0.1mm Min. line width: 0.1mm

6
6 layer mobile pcb
6 layer mobile pcb
Specification: 6 layer mobile PCB
Detail: 6 layers blind via Material:FR-4+RCC Thickness:1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Blind via structure:L1-L2,L5-L6 Min. line ***ce: 0.13mm Min. line width: 0.13mm

7
6 layer pcb with bga
6 layer pcb with bga
Specification: 6 layer PCB with BGA
Detail: HDI Material:FR-4+RCC Thickness:1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Min. line ***ce: 0.1mm Min. line width: 0.1mm

8
6 layers mobile pcb
6 layers mobile pcb
Specification: 6 layers mobile PCB
Detail: HDI Material:FR-4+RCC Thickness:1.0mm Copper thickness: 1oz Surface processing:immersion gold Laser drill hole(Min.):0.1mm Min. line ***ce: 0.1mm Min. line width: 0.1mm
Showing 1 - 8 of 8, total 1 pages        [First] [Previous] [Next] [Last]
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